How to achieve high-precision processing of IC packaging mold in microelectronics manufacturing?
Publish Time: 2025-03-17
The realization of high-precision processing of IC packaging mold in microelectronics manufacturing is a complex and meticulous process involving multiple links and key technologies.1. Material selection and heat treatmentMaterial selection: IC packaging mold selects materials with high strength, high hardness and high thermal stability according to the use conditions and performance requirements of the mold, such as high-performance materials such as powder alloy steel VASP23. These materials can withstand high processing pressure and temperature and are not easy to deform, thereby ensuring processing accuracy.Heat treatment: Through heat treatment processes such as quenching and tempering, the hardness and wear resistance of the mold are improved, while the internal stress is controlled to ensure the dimensional stability of the mold during processing.2. Processing equipment and technologyHigh-precision machine tools: Use high-precision EDM machine tools, CNC grinders and other equipment. These equipment should meet high-precision requirements in terms of mechanical properties of the structure, various geometric accuracy of the spindle and workbench. For example, the full closed-loop control method of the high-precision grating ruler can obtain extremely high automatic positioning accuracy, thereby ensuring processing accuracy.EDM: In EDM, a multi-electrode machining process is used. According to the different characteristics of the discharge gap in the rough, semi-finishing and finishing of the machining part, several electrodes with corresponding size scaling are used to complete the rough, semi-finishing and finishing of a cavity. At the same time, the intelligent control system of the machine tool is used to accurately input the machining conditions, such as the machining area, machining shape, electrode taper, etc., to achieve high-precision machining.Grinding: In the grinding process of IC packaging mold, suitable grinding wheels are selected, such as GD single crystal corundum grinding wheels, diamond grinding wheels with organic binders, etc., and the generation of grinding deformation and cracks is strictly controlled. At the same time, process measures such as magnetic isolation grinding, small feed amount and multiple light knives are adopted to improve the grinding effect and meet the parallelism requirements.3. Process optimization and detail controlProcess optimization: IC packaging mold formulates a reasonable processing process, including rough machining, heat treatment, fine grinding, electrical machining and other steps, and strictly controls the processing parameters and process conditions of each step.Detail control: During the processing, pay attention to the control of details such as electrodes and workpieces. For example, the manufacture of electrodes should meet high precision requirements and is generally completed by high-speed machining centers; the workpiece should be subjected to detailed projection measurement and positioning benchmark determination before processing; during the processing, pay close attention to the discharge of machining chips to avoid the influence of concentrated discharge and secondary discharge on the flatness and roughness of the workpiece.4. Quality inspection and feedbackQuality inspection: During and after the processing, the mold is strictly inspected for quality. Including inspections of dimensional accuracy, profiling accuracy, surface quality, etc. to ensure that the mold meets the design requirements.Feedback and adjustment: According to the quality inspection results, the processing process is adjusted and optimized. For example, fine-tuning of processing parameters, process conditions, etc. is performed to improve processing accuracy and efficiency.In summary, the realization of high-precision processing of IC packaging mold in microelectronics manufacturing requires comprehensive consideration of material selection, processing equipment and technology, process optimization and detail control, and quality inspection and feedback. By continuously optimizing and improving these aspects, the processing accuracy and quality of the mold can be significantly improved.
