The realization of high-precision processing of IC packaging mold in microelectronics manufacturing is a complex and meticulous process involving multiple links and key technologies.
The realization of high-precision processing of IC packaging mold in microelectronics manufacturing is a complex and meticulous process involving multiple links and key technologies.
The company was established in 2002 and focuses on precision mold design and manufacturing. Located in Panyu District, Guangzhou, the factory covers an area of more than 1,000 square meters and has 40 employees.